Recurring process for laser induced forward transfer and high throughput and recycling of donor material by the reuse of a plurality of target substrate plates or forward transfer of a pattern of discrete donor dots

ABSTRACT

The technology disclosed relates to high utilization of donor material in a writing process using Laser-Induced Forward Transfer. Specifically, the technology relates to reusing, or recycling, unused donor material by recoating target substrates with donor material after a writing process is performed with the target substrate. Further, the technology relates to target substrates including a pattern of discrete separated dots to be individually ejected from the target substrate using LIFT.

PRIORITY APPLICATION

This application is the U.S. national stage of PCT Application No.PCT/EP2016/052430, filed Feb. 4, 2016, titled “RECURRING PROCESS FORLASER INDUCED FORWARD TRANSFER AND HIGH THROUGHPUT AND RECYCLING DONORMATERIAL BY THE REUSE OF A PLURALITY OF TARGET SUBSTRATE PLATES ORFORWARD TRANSFER OF A PATTERN OF DISCRETE DONOR DOTS” which is relatedto and claims the benefit of U.S. Provisional Patent Application62,112,628, “Improved System and Method for Material Deposition”, filedon Feb. 5, 2015.

BACKGROUND

The subject matter discussed in this section should not be assumed to beprior art merely as a result of its mention in this section. Similarly,a problem mentioned in this section or associated with the subjectmatter provided as background should not be assumed to have beenpreviously recognized in the prior art. The subject matter in thissection merely represents different approaches, which in and ofthemselves may also correspond to implementations of the claimedtechnology.

This application relates to material deposition using Laser-InducedForward Transfer, also referred to as LIFT. LIFT is an industrialprocess of ejecting a patch of material from a donor sheet to anacceptor workpiece. The transferred material can be in the form of athin layer, a thick layer, a paste, a viscoelastic, or a liquid layer.The transfer does not depend on chemistry so any chemical compound canbe transferred. The transferred donor material can be a single film, acomplex film like an OLED stack, or a functional material like a layerof organic materials, including living cells. The film can betransferred as a melted drop, a pellet, a round patch or a complex shape(“decal”). A solid material can liquefy due to heating or due to itsrheological properties and return to solid after impact with theworkpiece. The impact energy can be high enough to give good contact andsticking to the acceptor surface. One application is to deposit metalfor electric conductors, e.g. for repair of circuits. Anotherapplication is jetting of “rheological material”, which are not solidand have a complex viscosity, e.g. pastes loaded with ceramic powder,metal particles or nanomaterials. Another application is jetting ofbiological substances, from reactants in diagnostic screen to livingcells for building of two- and three-dimensional tissues and grafts.

A principal of LIFT is that it is an additive process where material istransferred only where needed and therefore LIFT can save expensivematerials in contrast to a blanket coating on a workpiece whereinportions of the blanket coating are etched away or otherwise removedwhere the coating is not needed. LIFT is also a fast and simple one-stepprocess for creating a coating or a pattern, and is finished immediatelyafter the transfer with no need for pre-coating of the workpiece orresist processing. LIFT is therefore very suitable to direct writing infields like printed electronics, especially roll-to-roll processing,making of printing plates, sign making, and security printing.

LIFT may have similar applications as inkjet, however due to theflexible nature of LIFT it allows printing of many more materials:viscous, hard, dry, granular, and layered. The possible range of shotsizes is very wide from 1 micron in diameter and a thickness of 0.1micron to several nanoliters in volume. This is a larger range than canbe done by ink jetting. In particular LIFT can shoot smaller shots thanan inkjet system. The term laser jetting is used herein as synonymous toLIFT.

Despite the benefits of LIFT, it has not reached widespread use inindustry. One reason is current LIFT technology is a slow process wherethe donor sheet has to be physically moved relative to the workpiece.If, for reasons of efficient use of donor material, the donor sheetneeds to move relative to the stage such movements may take 30-100milliseconds. Other issues relate to holding the small gap between thedonor and the acceptor constant for large workpieces.

It is the purpose of this application to devise methods to make theprocess more industrial by providing architectures with high writingspeed and high precision and for easy adaption to different processconditions. Throughput is improved by reduced overhead and by using anuninterrupted feeding of donor to the writing head also for sticky,liquid, or perishable donor material. Methods are disclosed to combinecontinuous feeding of donor instead of step-wise movement and forefficient use of donor material. Printing speed and precision andprocess flexibility is improved by donor sheets design.

SUMMARY

The present disclosure relates to high utilization of donor material ina writing process using Laser-Induced Forward Transfer. Specifically,the technology relates to reusing, or recycling, unused donor materialby recoating target substrates with donor material after a writingprocess is performed with the target substrate. Further, the technologyrelates to target substrates including a pattern of discrete separateddots to be individually ejected from the target substrate using LIFT.

More specifically, the technology relates to addressing problems of lowthroughput and low utilization of, potentially expensive, donor materialassociated with currently available LIFT devices and processes. Theseproblems are addressed by the features related to a recurring process ofproviding a plurality of target substrate plates and concurrently withpulsing a laser beam through a first target substrate plate, recoatingwith donor material a second target substrate, where the secondsubstrate includes portions from which donor material was previouslytransferred in an iterative closed loop process.

The technology disclosed can provide the effect of efficient and highthroughput laser induced forward transfer of donor material to achieve ahigh utilization of the donor material in a LIFT process according tothe device and methods defined by the claims. According to someinvestigations made by the inventors, up to above 80% utilization rateof the donor material may be achieved.

As an example, the technology disclosed provides the effect of a highutilization of donor material by efficiently reusing, or recycling, thedonor material in a LIFT process. According to some investigations madeby the inventors, up to above 80% utilization rate of the donor materialmay be achieved by efficiently reusing, or recycling, the donor materialusing unused donor material from a previous writing process step. Thehigh utilization rate can be further improved by introducing newiterative closed loop processes as defined by the claims.

Further, the technology disclosed can provide the effect of highthroughput for the transfer of donor material to the workpiece byproposing a recurring process providing a plurality of target substrateplates and concurrently pulsing a laser beam through a first targetsubstrate plate, recoating with donor material a second target substratewhere the second substrate includes portions from which donor materialwas previously transferred in an iterative closed loop process.

Further, the technology disclosed can provide the effect of improvedutilization rate of the donor material by proposing a recurring processproviding a plurality of target substrate plates and concurrentlypulsing a laser beam through a first target substrate plate, recoatingwith donor material a second target substrate where the second substrateis recoated by reusing, or recycling, at least portions of the unuseddonor material remaining from a previous laser induced forward transferof donor material in an iterative closed loop process.

Other aspects and advantages of the technology disclosed can be seen onreview of the drawings, the detailed description and the claims, whichfollow.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, like reference characters generally refer to like partsthroughout the different views. Also, the drawings are not necessarilyto scale, with an emphasis instead generally being placed uponillustrating the principles of the technology disclosed. In thefollowing description, various implementations of the technologydisclosed are described with reference to the following drawings, inwhich:

FIGS. 1A-B illustrate embodiments of target substrates and mechanisms ofejecting donor material.

FIGS. 2A-C illustrate ejection donor material with an explosive layer.

FIGS. 3A-C depict a plurality of different types of feature that may becreated as part of a pattern on a workpiece.

FIGS. 4A-H illustrate ejection donor material from a film of donormaterial.

FIGS. 4I-L illustrate ejection of discrete dots of donor material.

FIGS. 5A-D illustrate example methods to achieve a high utilization ofdonor material by pre-assigning ejection locations.

FIGS. 6A and 6B illustrate the advantages of ejecting donor materialfrom the exact locations of pre-assigned dots on the target substrate.

FIGS. 7A and 7B illustrate the advantages of ejecting donor materialfrom the exact locations of pre-assigned dots on the target substrate

FIGS. 8A, 8B, 9A and 9B illustrate example embodiments of preformed dotsand examples of how the pre-formed dots may be formed on a transparentcarrier.

FIGS. 10A-10C illustrate methods using continuous motion of the targetsubstrate relative to the workpiece.

FIG. 11 illustrates redundancy in selecting a dot to select.

FIGS. 12A and 12B illustrate orienting the pattern of the workpieceaskew to the relative direction of motion.

FIGS. 13A, 13B, 14A and 14B illustrate orienting the pattern of theworkpiece askew to the relative direction of motion.

FIG. 15A illustrates an embodiment of a system including a recoatingstation, an exposure station and a plurality of target substrate plates.

FIG. 15B illustrates an embodiment of a system including a recoatingstation, an exposure station and a plurality of target substrate plates.

FIG. 15C-F illustrate embodiments of target substrates to be coated at aregeneration station.

FIG. 15G illustrates an embodiment of a system including a recoatingstation, an exposure station and a cassette holding a plurality oftarget substrate plates.

FIGS. 16A and 16B illustrate scanning paths of a target substrate plate.

FIGS. 17A and 17B illustrate examples of oblique relative scanning ofthe donor and workpiece.

FIGS. 18A-C illustrate examples of a target substrate belt scanned at anoblique angle relative to the axes of the workpiece.

FIG. 19 illustrates an embodiment of a system including a recoatingstation, an exposure station and a continuous belt target substrate.

FIG. 20 illustrates an embodiment of a system including an exposurestation and a reel to reel pre-coated target substrate.

FIGS. 21A and 21B illustrate an embodiment of an optical system andGaussian spot.

FIG. 22 illustrates a LIFT process for 3D printing.

FIG. 23 illustrates patterning the surface of a 3D object by LIFT.

FIGS. 24A and 24B illustrate embodiments of optical systems with spatiallight modulators.

FIGS. 24C, 24D and 24E show more in detail of how the pre-assignmentworks in an example embodiment.

DETAILED DESCRIPTION

The following detailed description is made with reference to thefigures. Sample implementations are described to illustrate thetechnology disclosed, not to limit its scope, which is defined by theclaims. Those of ordinary skill in the art will recognize a variety ofequivalent variations on the description that follows.

FIG. 1A depicts an embodiment of a donor sheet, also referred to hereinas a target substrate. In the embodiment shown, the target substrateincludes a transparent carrier 100, also referred to as a donorsubstrate and a layer of donor material 102. The transparent carrier 100provides support for the donor material 102 and is configured to betransparent to the laser beam to be absorbed by the donor material whichcauses LIFT to occur. In embodiments, the transparent carrier comprisesclear plastic, polyimide, PC, PET, PEN, thin glass, or a glass sheet; ora combination thereof. The thickness of the donor sheet may be between20 microns and 500 microns for plastic film and up to severalmillimeters for hard plastics and glass plates. The thickness of thetransparent carrier is determined based on the support and flexibilityrequirements of the donor material and specific LIFT application. Forexample, in embodiments a target substrate that is rolled for storageincludes a thin flexible transparent carrier.

In the example shown in FIG. 1A, the layer of donor material 102 is asingle layer film. However in embodiments, the film may include multiplelayers of donor material. For example the donor material may comprisemultiple layers, each of different composition, for example an OLEDstack. Further, in embodiments the donor layer may include a functionalfilm including organic materials or living cells.

As shown in FIG. 1A, in a single layer donor material embodiment, alaser pulse 108 is focused through the transparent carrier 100 and aportion 110 of the donor material at the interface of the transparentcarrier absorbs the laser energy and is evaporated. The vapor pressureof the evaporated donor material ejects a section of the donor materialacross a gap 106 to the acceptor surface 112 of a workpiece 104.

In embodiments, the donor material may not absorb light (e.g. atransparent material) and/or a may not evaporate cleanly. Therefore adynamic release layer, “DR”, or “explosive layer” may be used to assistwith LIFT. The explosive layer can be a thin semitransparent metal filmor a polymer layer loaded with a dye or pigment to absorb the laserlight efficiently. In embodiments, the explosive layer is configured sothat most of the laser energy is absorbed in the explosive layer andevaporates the explosive layer, giving an efficient conversion of laserpulse energy to mechanical work. The term “explosive” is used herein torefer to a reaction that happens in a very short amount of time, forexample nanoseconds, and does not refer to actual explosive material,for example nitroglycerine.

In embodiments the target substrate may include additional layers whichassist adhesion between layers of the target substrate and also aid instorage and rolling of the target substrate. For example, as shown inFIG. 1B, a surface active layer 122 may be located between the explosivelayer 120 and donor material 102 to allow adhesion of the explosivelayer 120 to the donor material 102. Further, in embodiments thetransparent carrier 100 may be affixed to a surface active layer 124 onthe outside surface which has properties that result in poor adhesion tothe donor material 102 or a surface active layer 126 affixed to theouter surface of the donor material, as shown in FIG. 1B. These one ormore surface active layers on the outside surface of the targetsubstrate allow the target substrate to be rolled or stacked for storagewithout causing damage to the donor material. The outside surface activelayer may be hydrophilic for fatty donor materials or hydrophobic forpolar donor materials, in order to prevent the donor material fromadhering to the outside surface. In embodiments, the surface activelayer may be a substantial film or may only a molecule thick. Thesurface active molecules, in a surface active layer, typically have oneend which sticks to the surface and another end with a specificallytailored surface energy, for example strongly polar or non-polardepending on if the surface active layer should adhere to anothersurface or not, and if that surface is polar or non-polar.

FIGS. 2A-C illustrate an example of the LIFT process using a targetsubstrate similar to the one illustrated in FIG. 1B. As shown in FIG.2A, a laser pulse 200 is emitted through the outside surface activelayer and the transparent carrier 100 and is absorbed by the explosivelayer 120. This absorption of laser energy causes the explosive layer120 to create an explosion 204 and gas bubble 206 between thetransparent carrier 100 and donor material 120 which ejects out a patch208 of the donor material. The ejected patch flies across the gap to theacceptor surface 104 of the workpiece and sticks there as a deposit ofdonor material 210.

In embodiments, the gap may be dependent on the thickness of the donormaterial on the target substrate and the number of overlapping layers ofdonor material to be deposited in a pattern on the workpiece. For aparticular process the gap between the donor and the acceptor need to beheld constant within a reasonable error, e.g. within +1-10%. The nominalgap depends on the process. The gaps has to be small for micron-sizedshots, e.g. around 50-100 microns, while for large shots with moderateprecision requirements the gap may be around 1-2 mm. Many applicationswill fall somewhere in the middle in the span 100-1000 microns.

Many possible workpieces are large in area. Electronic boards andsubstrates are often processed in panels up to 24 inches in width, andthe display industry use panels of 2-10 square meters in area. It isimpossible to maintain a constant gap over such areas, unless very flat,very stiff, and very expensive substrates are used for both donor andacceptor. In order to maintain a constant gap over a large, possiblynon-flat, workpiece a target substrate with a donor area much smallerthan the workpiece is used, and this target substrate is several timesduring the printing of a large workpiece. The renewal of donor substrateis done in an uninterrupted automatic fashion. In an example embodimentthe donor material comes from small target substrate, e.g. 50×50 to100×100 mm, which are automatically exchanged when the donor isconsumed. As discussed below, the target substrates may come from astock of prefabricated target substrates including donor material, orthe target substrates may be locally coated and recoated with donormaterial.

In a second example embodiment we use donor material on a tape, e.g. 30,60, or 100 mm wide, which may be loaded as a roll or by an endless beltwhich is regenerated while being fed.

The technology disclosed herein may be used to create a wide variety offeatures on a workpiece using LIFT. FIGS. 3A-C depict a plurality ofdifferent types of feature that may be created as part of a pattern on aworkpiece. FIG. 3A depicts a single shot 210 feature on the acceptorsurface 104. FIG. 3B depicts a plurality of shots 210 depositedadjacently to one another on the workpiece to cover a larger area of theworkpiece, for example to form a portion of a conductive line. FIG. 3Cdepicts a plurality of shots 210 deposited in a plurality of overlappinglayers to form a thick feature. The overlapping layers create a buildupof a mass of donor material which is thicker than a single depositeddot. In this example, a series of ejected dots are ejected to overlappreviously ejected dots until a desired thickness or volume has beencreated. When the surface finish of a feature is more important than theinterior composition, the shot quality, aim, and absence of splatter forthe interior shots is not critical, and therefore for the interior dotsthe LIFT parameters may be adjust in favor of speed over precision andfinish quality.

FIGS. 4A-H depict four example situations of ejecting donor materialfrom a target substrate to a workpiece. FIG. 4A depicts a laser beam 401ejecting a single dot 402 from a target substrate including atransparent carrier 404 and a layer of donor material 406. In thisexample, as shown in a bottom view of the donor material 406 in FIG. 4E,prior to ejection the dot 402 is connected on all sides to donormaterial 406 which will not be ejected. This uniform and consistentattachment around the perimeter of the dot to be ejected results in thedot being ejected uniformly resulting in perpendicular travel towardsthe workpiece 408, which results in a predictable result for thedeposited material.

FIG. 4B depicts an example where a dot to be ejected 410 is locateddirectly adjacent to a location 412 from which a dot 414 has previouslybeen ejected. As shown in FIG. 4F, a bottom view of the donor materialin FIG. 4B, the dot to be ejected 410 is attached to donor material,which will not be ejected in the shot, around most of its perimeter.However, a portion of the perimeter is directly adjacent to the location412 from which a dot 414 has previously been ejected and therefore thedot to be ejected 410 is not attached to donor material on one side.Therefore, the dot to be ejected is non-uniformly attached to donormaterial. When ejected, this non-uniform attachment results inunsymmetrical forces and the ejected dot may tumble and go in anon-perpendicular direction 416, as is shown in FIG. 4B, due to higherejection forces on the non-attached side. Further, the dot may fragmentinto satellites. The lack of precision of the resulting deposit in thiscase may not be suitable for the situations where precision depositionis required, for example the situations shown in FIGS. 3A and 3B whichrequire precise deposition. However, ejection of non-symmetricallyattached dots may be used for the fill mode, as shown in FIG. 3C,especially for the interior fill dots. This use of non-systematicallyattached dots improves the efficient use of donor area and allows fasterjetting by ejecting adjacent spots sequentially. Further, inembodiments, a predicted non-perpendicular trajectory of anon-symmetrically attached dot may be calculated and the dot may beejected at a location not directly above the target location for thedeposited material in order to compensate for the non-perpendiculartrajectory.

FIGS. 4C and 4G depict the jetting of a second dot 418 close to butseparated from the location 420 of a previously ejected first dot 422.If the second dot 418 is located a sufficient distance away from thelocation 420 of the previously ejected first 422 dot then the absence ofmaterial at the location of the previously ejected first dot does nothave an effect on the ejection of the second dot, and the second dotwill eject will similar parameters as the example in FIG. 4C.

FIGS. 4D and 4H depicts a target substrate including a plurality ofisolated islands 424 of donor material 412, attached to the transparentcarrier 404, which are transferred to the accepter surface 408. Asshown, the isolated islands 424 are discrete dots separated fromsurrounding dots. Using isolated islands of donor material has severaladvantages compared to the methods of ejecting portions of donormaterial from a continuous film of donor material, as shown in FIGS. 4Aand 4B. One advantage of ejecting isolated islands is that the dots canbe transferred without being sheared free from surrounding donormaterial, therefore less energy is required for ejection. Since lessenergy is needed to make the donor island free than is need for ejectinga plug, as in FIG. 4A, the target substrate may be highly sensitive tothe laser. Therefore, a smaller laser can be used compared to the casewhere the plug of donor material is sheared free, as in FIG. 4A. Thekinetic energy of a small donor dot is quite small and very littleevaporated donor material is needed to propel the ejected donor dot tothe acceptor.

When the interface material between the isolated island of donormaterial and the transparent carrier is evaporated, the adhesion of theisolated island of donor material to the transparent carrier isimmediately lost because there is no surrounding donor material attachedto the isolated island with shear force. This is true even if theevaporated interface material is extremely thin. Therefore it ispossible to make a very sensitive donor sheet, by utilizing an extremelythin exploding layer. The absorption of light is high so the lightenergy stops within the thin film and the laser pulse is very short inorder to lessen the heat spread by heat diffusion during the duration ofthe laser pulse. Polymers, used as an explosive layer, typically have athermal diffusion constant of 10⁻⁷ m²/s. With a 100 femtosecond laserpulse the heat diffusion length is only 100 nm and a very thin layer isevaporated or disintegrated into gas, needing only little energy. 100mJ/cm² is a typical energy for LIFT of a plug from a sheet of donormaterial, with preformed dots the energy may be less than 10 mJ/cm²using short-pulse lasers and a properly tuned explosion layer. With lowpulse energy the writing system is simplified and the donor is lessaffected by heating.

Since each donor island is free, i.e. not attached to any surroundingdonor material, the aiming and uniformity of the laser jetting ispredictable. Further, dots may be formed on the transparent carrier withhigh precision leading to dots with highly uniform size and shape. Forexample, the preformed dots can be made by molding or printing from amaster, or they may be formed by filling of pits which are made from aprecision master. In addition, the dots can be made by liftoff or otherphotolithographic process using a precision photomask as a master. Theseprecision methods give highly precise and uniform dots. Alternatively,other less precise methods of forming dots may be used, includingink-jetting the dots onto a donor sheet. Dots formed by ink-jetting areless precise because ink-jetting may have uncertainty in aiming, shotsize and edge quality.

FIGS. 8A, 8B, 9A and 9B show example embodiments of preformed dots andexamples of how the pre-formed dots may be formed on a transparentcarrier. FIG. 8A shows a profile view of preformed dots 802 on a flatsurface of a transparent carrier 804, e.g. a polycarbonate film or aglass plate. The dots 802 may be formed by molding. FIG. 8B showspreformed dots formed by gravure-like printing from a master, here acylinder 806, with pits 808 in the surface of the cylinder. The cylindermay be engraved to form the pits mechanically, chemically or opticallyor it can use a shim envelope with the pattern on. The dots may beformed in a grid pattern on the roller and the substrate. The donormaterial 810 is fed through a dispenser 812 onto the cylinder 806including the pattern of dots. The cylinder is squeegeed, with asqueegee or scraper 814, to remove excess material 816 so that the onlyremaining material resides in the pits 816 on the cylinder 806. Afterfilling the pits 808 on the cylinder, the cylinder 806 is rolled acrossa target substrate transferring the donor material in the pits to form agrid of separated discrete dots 804 on the target substrate. Inembodiments, once deposited the dots may be cured onto the donorsubstrate. Further, in embodiments the donor substrate may include alayer to aid in adhesion of the donor material to the donor substrate.

In FIG. 9A, the donor substrate 902 includes pits 904 in a surface ofthe substrate. The pitted donor substrate can be produced by injectionmolding, heat embossing or nano-imprinting. In embodiments, the pits inthe surface form a grid, for example in a Cartesian or hexagonalpattern. The donor material 906 is easily added to the pitted substrateas is shown in FIG. 9B and form isolated preformed dots 908 similar toas shown in FIG. 8A. For example, a paste or soft donor material may bedeposited on the surface of the donor. The excess material may bescraped off by a sharp blade 910, e.g. a “doctor blade”, or it may bescraped off by a soft edge, e.g. a “squeegee”, depending on themechanical properties of the donor.

The shape of the preformed dots on the target substrate defines theshape of the transferred donor features and therefore the opticsrequirements are relaxed compared to embodiments such as shown in FIG.4A wherein the shape of the deposited material is primarily dependent onthe properties, e.g. shape, power and duration, of the laser beam pulsedthrough the target substrate. FIG. 4I shows and embodiment of a targetsubstrate including a grid pattern of preformed dots 430 wherein thepreformed dots are smaller than the focus area 432 of the laser beamused to eject the preformed dots. This allows both the shape andlocation of the laser beam to be less precise while still resulting in awell aimed ejection of donor material. As shown in FIG. 4I, the size ofthe focus area 432 of the laser beam is small enough and the spacing ofthe preformed dots is large enough so that ejecting a first preformeddot 434 does not result in ejection of the preformed dots 436surrounding the first preformed dot 434.

FIG. 4J illustrates a donor sheet including preformed features 438having different shapes, sizes and orientations, for example firstpreformed feature 440 has a “T” shape and second preformed feature 442has a square shape. To use a donor sheet as shown in FIG. 4J the systemcontroller assigns the donor features to pattern elements on theworkpiece. Further, similar to discussed above relating to FIG. 4I, toeject a preformed feature 438 using LIFT, the focus area 432 of thelaser beam used to eject the preformed feature is larger than thepreformed feature.

While the examples shown in FIGS. 4I and 4J include X-Y Cartesian grids,in embodiments the target substrate may be coated with donor material inany number of discrete dot configurations. For example, a hexagonalpattern. Further, as noted, the discrete dots may be of any shape, forexample circular, oval, square triangular, or a shape corresponding to astructure of an electronic component to be formed on the workpiece, forexample a transistor or a diode. The shape of the discrete dot mayinclude a 2-dimensional outline with uniform thickness throughout thedot. In embodiments, the shape may be 3-dimensional with portions of adot having different thickness, as is shown in FIGS. 4K and 4L. In FIG.4K, preformed features 444 on a flat donor substrate 446 have varyingthickness. Once ejected, the resulting deposited dot 448 includescorresponding varying thickness, as is shown in FIG. 4K.

In FIG. 4L a donor substrate 450 includes pits 452 have varying depthresulting in the ejected deposited dots 454 having varying thickness. Asshown in FIGS. 4K and 4L, ejecting a discrete dot with varying thicknesswill result in deposited donor material on the workpiece with varyingthickness. Further in embodiments, the grid of discrete dots may includedots of two or more different thicknesses.

In embodiments wherein the laser beam focus area on the preformed dotsis larger than the outline of the preformed dots, such as shown in FIGS.4I and 4J, the donor sheet is configured so that the required energy ofthe laser to eject a discrete dot does not damage the workpiece when theportions of the laser beam that do not hit the preformed dot hit theworkpiece. Further in embodiments, the donor sheet may include a lightabsorbing layer around the preformed dots which absorbs the laser beamaround the preformed dots.

In addition to achieving uniform ejection and high utilization of donormaterial using the discrete dot method discussed above, uniform ejectionand high utilization of donor material may also be accomplished using afilm of donor material on a target substrate by pre-assigning dotslocations to eject donor material. As discussed above relating to FIG.4B, ejecting non-symmetrically attached dots of donor material may beundesirable due to non-perpendicular and or unpredictable ejection ofdonor material. Therefore in some cases it is desirable to only ejectdots of donor material attached to unejected on all sides during apatterning process. However, this results in large portions of donormaterial remaining on the transparent carrier that will not be used,which is not an efficient utilization of donor material. This lowutilization of donor material is undesirable, particularly if the donormaterial is expensive.

FIGS. 5A and 5B depict an example method to achieve a high utilizationof donor material, using a target substrate including a layer of donormaterial, by pre-assigning ejections locations for dots of donormaterial. Using the LIFT process a pattern is formed on a workpieceusing donor material ejected from pre-assigned dot locations on a targetsubstrate through a combination of positioning and repositioning of thetarget substrate relative to the workpiece, and using optics to positionthe laser beam in the appropriate location to focus on a pre-assigneddot location for ejection of donor material.

In embodiments the pre-assigned dot locations form a tight pattern, withvery little or no donor material between pre-assign dots. A tightpattern achieves high utilization of the donor material. In embodiments,the pattern of pre-assigned dots may be divided into sub-patterns,wherein all the dots in a sub-pattern are ejected prior to ejecting dotsin other sub-patterns. For example, dots in a first sub-pattern are eachejected in a first pass prior to ejecting the dots in a secondsub-pattern in a second pass. The sub-patterns each contain a pluralityof pre-assigned dots which will have symmetrical attachment tosurrounding donor material after the donor material in the pre-assigneddot locations of the previous passes are ejected. Therefore the use ofpatterns, with sub-patterns, of pre-assigned dots is both efficient andleads to high quality ejections due to avoiding the ejection problemscaused by ejection of dots with non-uniform/symmetrical attachment tosurrounding donor material.

FIGS. 5A and B illustrate an example of a pattern of pre-assigned dots.The pattern is a hexagonal pattern divided into three sub-patterns to beejected in three sequential passes. The three passes result in the dotsof each pass having symmetrical attachment to the surrounding unejecteddonor material which avoids the problems illustrated in FIG. 4B where anejected dot is non-symmetrically attached to surrounding donor materialand ejects with a non-perpendicular trajectory.

FIG. 5A shows a donor sheet including a layer of donor material 500. Thelocations of the pre-assigned dots are shown for illustrative purposeswith different fill patterns, however in implementation there are notmarkings or indications on the donor sheet for the pre-assigned dotlocations. As shown, on the left side of the donor sheet there is aplurality of first pass pre-assigned dot locations 502, illustrated witha fine diagonal fill pattern. In the middle of the donor sheet, are aplurality of first pass pre-assigned dot locations 502 and a pluralityof section pass pre-assigned dot locations 504, illustrated with acoarse diagonal fill pattern. As illustrated the first pass pre assigneddot locations 502 overlap on three sides, in a radially symmetrical way,with three second pass pre-assigned dot locations 504. On the right sideof the donor sheet, are plurality of first pass pre-assigned dotlocations 502, a plurality of second pass pre-assigned dot locations504, and a plurality of third pass pre-assigned dot locations 506,illustrated with a medium vertical line fill pattern. As depicted, thehexagonal pattern includes interstitial space between the first passpre-assigned dot locations 502 occupied by second pass pre-assigned dotlocations 504 and third pass pre-assigned dot locations 506.Specifically, the interstitial space is occupied by three second passpre-assigned dot locations 504 and three third pass pre-assigned dotlocations 506 around and overlapping the first pass pre-assigned dotlocation 502 in an alternating pattern of second and third passpre-assigned dot locations.

FIG. 5B depicts a donor sheet depicting portions after the firstejection pass, after the second ejection pass and after the thirdejection pass. The left side of FIG. 5B, depicts a portion of the donorsheet after the ejection of the first pass. Prior to ejection, each ofthe dots 508 ejected in the first pass were entirely attached tosurrounding donor material.

The middle portion of FIG. 5B depicts a portion of the donor sheet afterthe ejection of the second pass. Prior to the second pass ejection, eachof the dots 510 ejected in the second pass, illustrated with a hatchedcircle, were symmetrically detached from donor material on three sidescorresponding to three locations previously occupied by three dotsejected in the first pass. This symmetrical attachment and detachmentresults in perpendicular transfer of the dots, as discussed above.

As shown on the right side of FIG. 5B, the pre-assigned third dots 512are ejected in a third pass. Prior to ejection during the third pass,each of the dots 512 ejected in the third pass, illustrated with ahatched circle, are detached from donor material on all sidescorresponding to three locations previously occupied by donor materialejected for three first dots in the first pass and three locationspreviously occupied by donor material ejected for three second dots inthe second pass. The ejection of the third dots in the third pass issimilar to the ejection of discrete dots discussed above, and results inperpendicular transfer of the dots with lower required laser energy toeject the dots because no shearing from surrounding donor material isrequired. As shown in the right side of FIG. 5B, after ejection of theall three passes essentially 100% of donor material in areas of thetarget substrate exposed to all three passes is transferred due to thevery dense packing of dots in the hexagonal pattern, which included aslight overlap of dots in each of the passes. As noted above, this highutilization is beneficial when the donor material is expensive.

As shown in the examples in FIGS. 5A and 5B, the dots in each pass arethe same size as the dots in the other passes. In embodiments, the laserenergies, duration, and focus areas used for the three sets of dots canbe tuned so that the three sets of dots have the same volume. Forexample, because the second pass dots require less shear energy toremove the dot from the target substrate less laser energy may be used.

The depicted hexagonal pattern of dots is for exemplary purposes and inembodiments other patterns of dots may be used to achieve similar highutilization of donor material. For example, as depicted in FIG. 5C, atarget substrate may include a stripe of donor material 550 attached toa transparent carrier 551. The stripe of donor material divided into apattern of strips to be ejected in two passes, including strips of afirst pass 552, illustrated with a cross hatch fill, and strips of asecond pass 554, illustrated with a fine diagonal line fill. As shown,the first pass strips 552 are attached to donor material on two sidesprior to ejection in a first pass. Further, the second pass strips 554are not being attached to any donor material after the first pass ofstrips are ejected. Therefore, symmetrical attachment and detachment isachieved in both passes and ejection of both passes will be uniform.

FIG. 5D depicts another example embodiment of a pattern of pre-assigneddots to be ejected from a film of donor material in multiple passes. Thepattern includes an X-Y array of square shaped dots. As depicted, thedots include dots to be ejected in a first pass 556 and dots to beejected in a second pass 558. As shown on the left side of FIG. 5D,prior to ejecting the first pass the first pass dots 556 are attached onall four sides by second pass dots 558. However, during the first pass,prior to ejection some first pass dots are surrounded by less than fourfirst pass dots on the corners of the dot due to prior ejection of firstpass dots. For example first pass dot 560 is only surrounded by firstpass dots 556 on two corners. Because the dots around the corners of asquare dot are essentially not attached to the square dot, the presenceor absence of donor material at the corner dot locations will have anegligible or no effect at all on the systematical ejection of the dot.

Further, as shown, prior to being ejected in the second pass second passdots 558 are detached on all four sides, after ejection of dots in thefirst pass. This symmetrical detachment leads to uniform ejection asdiscussed above. However, during the second pass, prior to ejection somesecond pass dots are surrounded by less than four second pass dots onthe corners of the dot due to prior ejection of second pass dots. Forexample second pass dot 562 is only surrounded by second pass dots 558on two corners. As noted above, because the dots around the corners of asquare dot are essentially not attached to the square dot, the presenceor absence of donor material at the corner dot locations will have anegligible or no effect at all on the systematical ejection of the dot.

The illustrative embodiments have shown high utilization and symmetricalejection achieved with two and three pass example. However inembodiments, other numbers of passes may be used. For example, thehexagonal pattern shown in FIG. 5A may be divided in four sub-patternsto be ejected in four passes, wherein each pass include symmetricallyattached dots.

FIGS. 6A and 6B further illustrate the advantages of ejecting donormaterial from the exact locations of pre-assigned dots on the targetsubstrate. FIG. 6A shows a regular array of pre-assigned dot positions602 on a donor. The target substrate may be scanned across the surfaceof an acceptor workpiece to align the pre-assigned dots with targetspots of a pattern on the workpiece. In embodiments, the mechanicalmotion of the scanning may not be fast enough to position a pre-assigneddot position on the target substrate to the exact position of the targetspot on the workpiece. Therefore, instead of ejecting donor materialfrom the exact locations of the pre-assigned dots as shown in FIG. 6A,the laser beam is slightly shifted using a fast servo and shot to ejecta dot of donor material near a pre-assigned dot position, as shown inFIG. 6B. FIG. 6B provides an example result of precise targetingachieved by shifting the position of the actual ejected dot of donormaterial. As shown, some of the dots in the array of ejected dots 604are shifted from the pre-assigned dot positions 602, illustrated withhatched circles. Because the irregularly size and position of theinterstitial space between the ejected dots in FIG. 6B, the surfacefilling scheme in FIGS. 5A-B cannot be used because the shifted dotsremove material in locations of pre-assigned dots in subsequent passes.

FIGS. 7A and 7B show an example similar to FIGS. 6A and 6B wherein theinitial grid of pre-assign dots 702 includes a larger separation whichallows the dots to moved+/−0.5 dot diameters before they risk mergingwith another dot moved in the opposite direction. In FIG. 7B an examplepattern of ejected dots 704, relative to the initial grid of pre-assigndots 702, is shown after the laser beam is shifted for some dots toachieve ejection at a precise target spot on the workpiece. As shown inFIG. 7B, the result is also an inefficient use the donor area.

In order to achieve precise deposition of donor material at target spotson a workpiece while using pre-assigned spots without shifting the laserbeam as shown in FIGS. 6A-7B, methods using continuous motion of thetarget substrate relative to the workpiece may be utilized. In previousLIFT processes the donor sheet is position over a portion of theworkpiece and while stationary a plurality of areas of donor materialare ejected onto the workpiece to form a pattern. This process is slowand does not result in high utilization of the donor material.

FIGS. 10A-14B depicts methods using continuous motion of the targetsubstrate relative to the workpiece to achieve precise deposition ofdonor material and high utilization of donor material. In embodiments,the target substrate is caused to move relative to the workpiece andwith relative motion a laser causes ejection of donor material onto theworkpiece.

Aspects of technology discussed above, relating ting to FIGS. 5A-D,8A-B, and 9A-B may be used with the continuous motion technologydisclosed herein. FIG. 10A depicts a method of selecting a pre-assigneddot location to be ejected onto a target spot 1002 on a workpiece. Asdiscussed above, pre-assignment allows for greater utilization of donormaterial as oppose to ejection at random locations. As shown, the targetsubstrate including a grid pattern of pre-assigned dot locations 1004that are aligned at an oblique angle relative to the relative motion1006 of the target substrate and workpiece. While in this example, thetarget substrate includes a film with pre-assigned dots, similarembodiments may include a target substrate with a grid pattern ofdiscrete dots which may be aligned at an oblique angle relative to therelative motion of the target substrate and workpiece. Due to theoblique angle alignment, a plurality of pre-assigned dot locations,including locations 1008, 1010, 1012, 1014, 1016 and 1018, will overlapthe central portion of the target spot 1002, as the target substratemoves along the path of relative motion 1006 over the workpiece. Asillustrated, some of the plurality of pre-assigned dot locations 1008,1010, 1012, 1014, 1016 and 1018 will overlap the target spot 1002 morethan others. Due to the preassigned nature of the dots, there may not bea dot that will exactly overlap with the target spot. The control systemof the writer may include a predefined error threshold relating to theallowable error between a target spot on the workpiece and the locationof deposited material from a pre-assigned dot location. If ejection of apre-assigned dot will overlap the target spot within the error thresholdthen the pre-assigned dot may be selected to be ejected. FIG. 10B showsthe positions of deposited material from dot locations 1008, 1010, 1012,1014, 1016 and 1018 relative to the target spot 1002. As shown, dotlocation 1018 results in the smallest error and if within thepreselected error threshold may be selected. However, if another dot,for example dot location 1008, overlaps target spot 1002 prior to dotlocation 1018 and is within the error threshold, then dot location 1008may be selected because it overlaps first in time even though it doesnot have the smallest error. In embodiments, both order of dots anderror deviation from the target spot may be used to determine theselection of pre-assigned dot to be ejected.

The embodiment shown in FIG. 10B utilized an on demand laser that may befired when the selected pre-assigned dot is in alignment with the targetspot in the direction of relative movements. This is evidenced by thedots in FIG. 10B only having an error deviation from the target spot inone direction. In embodiments, the laser may be a pulsed laser that maynot be fired on demand. In these embodiments, the selected dot may havean error in both the direction of relative motion and the directionperpendicular to relative motion as is shown in FIG. 10C. Similar to asdiscussed above relating to FIG. 10B, the pre-assigned dot that iswithin the error threshold in both directions is selected to be ejected.

During the exposure process, the first pre-assigned dot location on thetarget substrate within the error threshold for a target spot mayalready have been ejected and therefore cannot be used again. Thereforein embodiments, a pre-assigned dot location that subsequently overlapsthe target spot may be selected and ejected. In embodiments, a largererror threshold allows for greater redundancy and further allows foroptimization for efficient use of the pre-assigned spots. For example,as shown in FIG. 11, the first pre-assigned dot location 1102 is withinthe error threshold to be selected for ejection onto the target spot1104, however first pre-assigned dot location 1102 has already beenejected. Therefore, another pre-assigned dot within the error thresholdmust be selected. As shown, a plurality of pre-assigned dot locations1106, 1108, 1110, 1112, 1114, 1116, and 1118 are within the errorthreshold and may be selected to be ejected onto the target spot. Theredundancy makes it possible to select different dots and optimize otherparameters, e.g. time or utilization of donor area. In embodiments thefiner the grid of preassigned dots, the smaller the error threshold thatmay be selected and still allow for redundancy, as well as the betterutilization of donor material since many dots will be within an errorthreshold to be ejected. In embodiments, prior to selection it may bedetermined that the next dot to overlap the target spot within the errorthreshold would be better for a different target spot because it willresult in overall better utilization of the donor material, and anotherdot within the error threshold may be selected.

In embodiments, the laser cannot issue two pulses in immediate adjacencybut must have time to build up the pulse energy. Therefore, inembodiments sequential pre-assigned dots for ejection are selectedtaking into account the pulse timing parameters of the laser.

The donor material has a limited number of possible positions and theymust be used efficiently. If the donor material has a pre-defined gridof dots, either physical patches of donor material or assigned spots onthe surface, each dot can be pre-assigned to a position on the workpieceand a job plan calculated which satisfies the different restrictions andgives efficient use of time and donor material. In embodiments, thetarget locations matched with the pre-assigned dots are selected priorto any ejection in order to maximize the utilization of the donor sheet.However, in embodiments, the assignment may be done on the fly and thenext dot within the next predetermine number of dots that has thesmallest error which is lower than the error threshold is selected to beejected onto the target location.

In embodiments, with certain geometries of patterns on a workpiece it isbeneficial to rotate the axes of the pattern relative to the directionof relative movement of the target substrate and the workpiece. FIG. 12Adepicts a grid of target spots 1202 to be patterned on a PCB workpiece1204. The grid of target spots 1204 has an X and Y axes, which may bereferred to as Manhattan geometry of the PCB. PCBs frequently includeManhattan Geometry wherein lines and pads are configured in a grid-likepattern with 90 degree angles.

Using the methods to scan and eject pre-assigned dots from a targetsubstrates, as discussed above, may result in the pattern of ejecteddots 1206 shown in FIG. 12A. As shown, the ejected dots 1206 are alongstripes on the target substrate, and these stripes are separated by astripe of un-ejected dots. With this orientation of the pattern relativeto the movement 1208 of the target substrate and the workpiece, somestripes of pre-assigned dots on the target substrate will be depletedwhile other stripes are depleted to a much lower level or not at all.This leads to poor utilization of the donor material of the targetsubstrate.

Therefore, in embodiments in order to increase the utilization of thedonor material when patterning a workpiece with a pattern includingManhattan geometry, the pattern is aligned askew to the relative motion1208 of the donor sheet and workpiece as is shown in FIG. 12B. As shownin FIG. 12B, the ejected dots 1206 are more evenly distributed acrossthe target substrate than in FIG. 12A. This more even distribution iscaused by the askew alignment of the pattern relative to the relativemotion of the target substrate and workpiece.

FIGS. 13A, 13B, 14A and 14B further illustrate the concept of orientingthe geometry of the PCB 1302 askew to the direction of relative motion1304 of the donor sheet and workpiece in order to more evenly distributethe usage of donor material across the donor sheet in a directionperpendicular to the relative direction of motion. As shown in FIG. 13Aa circuit board is aligned with the Manhattan geometry features parallelto the direction of movement 1304. FIG. 13B shows a histogram of thedistribution of required donor material to be deposited, where theY-axis shows required donor material and the X-axis corresponding topaths parallel paths in the direction of motion across the targetsubstrate in a direction particular to the direction of motion. Asshown, this parallel alignment causes paths that include high usage ofdonor material where stripes of contact lines are formed. And furthercauses areas where very little donor material is required to bedeposited. This creates very poor utilization of donor material becausemany paths along the direction of relative motion will hardly be used atall, while also a very large area of donor material along a path on atarget substrate will be needed in order to deposit the material need inthe spikes.

Therefore, as shown in FIGS. 14A and 14B, by aligning the Manhattangeometry 1302 askew to the direction of relative movement 1304, thefeatures that previously required high amounts of donor material along asingle path are now spread over several paths and therefore thedistribution of required donor material is evened out.

As discussed above, high utilization of donor material may be achievedusing by using a high proportion of the donor material deposited on atarget substrate. These methods of high utilization of donor areespecially useful in cases where it is practical to use prefabricatedtarget substrate, for example target substrates including complex films.However, in embodiments prefabricated target substrates may not bepractical due to properties of the donor material. For example, if thedonor material is solid and dry or if it is perishable, it is beneficialto coat the transparent carrier only a short time before it is used.Example materials include perishable materials which dry or harden, suchas solder paste, nanopaste, and conductive adhesive, and various gluesand paints. The solder paste used in surface mounting needs to be tackysince components are pressed into the paste and sticks by the tackiness.The paste also has a limited useable time when exposed to air. Otherperishable materials are foods and biological substances or structures.Also some chemical compounds have a limited life in air, e.g. organicelectronic materials.

Therefore in embodiments, high utilization of donor material may beaccomplished through methods which include coating a target substratewith donor material prior to LIFT exposure. These embodiments mayinclude methods of reusing, or recycling, unused donor material fromtarget substrate from which donor material was previously ejected andrecoating the used target substrates.

FIG. 15A illustrates an embodiment of a LIFT system including anexposure station 1502 and a regeneration station 1504, also referred toas a recoating station. The system includes a plurality of targetsubstrate plates 1506 that are transferred from the exposure station1502, to the regeneration station 1504, and back to the exposure station1502 using a conveyer belt/robot system. To pattern a workpiece 1508, aworkpiece is placed on a stage and a smaller target substrate plate 1506is positioned above it. An optical system with a pulsed laser 1510 andfast deflection of the light beam illuminates the target substrate. Bymovement of the long-stroke but slow stage and the small field opticalscanner 1512 any point on the substrate 1506 can be placed on top of anypoint of the workpiece 1508 and a laser pulse can eject donor at thatpoint. Random positioning of the mechanical stage takes around 100milliseconds and short-range repositioning takes typically 30milliseconds. The fast optical scanner can reposition the beam in 100microseconds, using galvanometer mirrors, or 5 microseconds, using anacousto-optic scanner. The combination of slow and fast movements allowsthe laser to flash at a rate that is limited only by the opticaldeflection, i.e. one flash per 5 microseconds. In, embodiments, thesystem may include multiple beams or multiple optical trains, each withits own laser. The laser may be a diode pumped solid state laser, eitheron the fundamental wavelength 1.06 microns or frequency-doubled to 0.53microns. Tripling to 0.355 micron or quadrupling to 0.266 microns ispossible and lasers with other fundamental wavelengths may be used. Inembodiments, a flashlamp may be used.

After the donor material on a target substrate 1506 has been used to apoint where it becomes difficult to continue to write at maximum speed,a mechanical handle swaps the target substrate for a new targetsubstrate. The used target substrate is sent for regeneration to theregeneration station 1504.

In the embodiments discussed various coating and recoating methods maybe utilized at the regeneration station to coat a transparent supportcarrier with a donor material, either in a layer or a grid of preformeddots, as previously discussed relating to FIGS. 8A, 8B, 9A and 9B. Inembodiments, the regeneration station may deposit other layers that arecompatible with the LIFT process, for examples explosive layers andsurface active layers, as discussed above.

In embodiments, at the regeneration station, prior to recoating a targetsubstrate with donor material, the remaining donor material on thetarget substrate may be removed. Removal may be done with a scraper or asolvent, depending on the properties of the transparent carrier and ofthe donor material. The removed donor material may be processed andreapplied to one of the plurality of target substrates 1506 in thesystem. After removal of remaining donor material from a targetsubstrate new donor material, reprocessed donor material, or acombination thereof may be applied to the target substrate in a layer ora gird of preformed dots.

As shown in FIG. 15A, an embodiment may include eight target substrates1506 in circulation with one target substrate in the exposure station1502 used for writing a pattern, one in regeneration station 1504, andsix in queue for writing and/or regeneration. With a number ofsubstrates in queue the operation of writing and regeneration becomesfully decoupled and both can run at their inherent speeds and evenabsorb minor hiccups in one process without disrupting the otherprocess. If one of the processes have an unequal speed the targetsubstrates will stack up waiting for the slowest process, making itfaster by assuring that the slower process will never wait for material.Other embodiments may include only two or three target substrates 1506in closed loop circulation between the exposure station 1502 used forwriting a pattern and the regeneration station 1504 used for recoatingthe target substrates, wherein one target substrate 1506 may be exposedin a LIFT process at the exposure station 1502 simultaneously orconcurrently with a second target substrate 1506 being recoated at theregeneration station 1504.

In embodiments, a depleted target substrate 1506 is moved by a roboticconveyer system to the regeneration station 1504 and to the exposurestation 1502. LIFT processes frequently positions the target substrateplates with the donor material side facing downwards toward theworkpiece due to gravity assisting the transfer process. However, whenrecoating the donor substrate plate it is sometimes beneficial for theface of the target substrate plate to be recoated to be facing upwards.This is particularly beneficially for granular, crumbling, or liquiddonor material. It is easier to coat the substrates by a scraping methodwhen the donor side of the target substrate is facing up. The materialcan be put on top of the substrate and pressed into a thin layer bymeans of a scraper without falling off in the process. After excessmaterial has been scraped off the target substrate can be flipped by therobotic conveyer system which changes the orientation of targetsubstrate plates when they are transferred between the exposure stationand the recoating station, so that the face including or receiving thedonor material is facing the correct direction for the application. FIG.15B depicts an embodiment, similar to the embodiment shown in FIG. 15A,wherein the target substrates are sent between exposure station 1502 andregeneration stations 1504 and flipped 1514 between them with a roboticconveyer system.

According to certain aspects and advantages of the technology disclosedin FIG. 15A and FIG. 15B, unused donor material from previous processsteps can be reused, or recycled, in an iterative closed loop processwhere a target substrate 1506 is moved by a robotic conveyer systembetween the regeneration station 1504 and the exposure station 1502.LIFT processes frequently positions the target substrate plates with thedonor material side facing downwards toward the workpiece due to gravityassisting the transfer process. The iterative coating, or recoating, ofthe target substrate may then include depositing additional donormaterial on the outer face of the substrate and recoating a layer ofdonor material on the outer face of the target substrate using a mixtureof the deposited additional donor material and donor material remainingon the target substrate plate after previous exposure(s) from whichdonor material was transferred from the target substrate.

The iterative process and devices as illustrated in FIG. 15A and FIG.15B may include a recoating the layer of donor material by scraping,e.g. using at least one blade, scraper or squeegee, the donor materialover the surface of the target substrate plate to thereby create an evenlayer of donor material on the surface of the target substrate plate.The scraping may be performed after additional donor material has beenapplied in that unused donor material from a previous laser inducedforward transfer step (or exposure step) is mixed with additional donormaterial applied to the target substrate plate.

The iterative process and devices as illustrated in FIG. 15A and FIG.15B may include an iterative recoating step where the donor material isrecoated by using at least one of spin coating, spray coating,dip-coating and an air knife to create an even layer of donor material.These coating techniques and methods may also be combined with using atleast one blade, scraper or squeegee for scraping the donor material,e.g. scraping a mixture of additional donor material and unused donormaterial from a previous laser induced forward transfer step (orexposure step), to thereby create an even layer of donor material on thesurface of the target substrate plate.

However, for some applications in an iterative process where a targetsubstrate 1506 is moved by a robotic conveyer system between theregeneration station 1504 and the exposure station 1502, it is sometimesbeneficial for the face of the target substrate plate to be recoated tobe facing upwards. This is particularly beneficially for granular,crumbling, or liquid donor material. It is also easier to coat thesubstrates by a scraping method when the donor side of the targetsubstrate is facing up. The material can be put on top of the substrateand pressed into a thin layer by means of a scraper without falling offin the process. It is also easier to coat the substrates by spin coatingor spray coating when the donor side of the target substrate is facingup. After recoating, the target substrate can be flipped by the roboticconveyer system which changes the orientation of target substrate plateswhen they are transferred between the exposure station and the recoatingstation, so that the face including or receiving the donor material isfacing the correct direction for the application. FIG. 15B depicts anembodiment, similar to the embodiment shown in FIG. 15A, wherein thetarget substrates are sent between exposure station 1502 andregeneration stations 1504 and flipped 1514 between them with a roboticconveyer system.

As noted above, FIGS. 8A, 8B, 9A and 9B show methods of formingpreformed dots on a transparent carrier, which may be performed at theregeneration stations disclosed herein. In embodiments, at theregeneration station the target substrate may be coated a film of donormaterial and in embodiments the donor substrate may include featureswhich aid in the recoating process.

FIGS. 15C-F show embodiments of coating donor substrates with a layer ofdonor material which may be done at the regeneration station. In theembodiments shown in FIGS. 15C-F, at the regeneration station new donormaterial is added to the transparent carrier and the donor material isscraped to form a smooth film. After coating, the film is inspected forholes and other irregularities. After inspection, the target substrateis transported back toward the exposure station and queued up to be usedagain in another LIFT patterning process.

FIG. 15C depicts an embodiment of a donor substrate 1502 with mayinclude a recess 1504 between two side walls 1506, wherein donormaterial is deposited into the recess and a scraper 1508 is guided bythe tops of the sidewalls 1506 in order to achieve a desired donormaterial coat thickness. The sidewalls act as a guide for the scraper tocontrol the thickness of donor material deposited on the targetsubstrate. Specifically, to coat or recoat the target substrate shown inFIG. 15C, a donor material is deposited into the recess filling therecess above the tops of the sidewalls. A scraper is then placed againstthe tops of the sidewalls and pulled across the sidewalls to create asmooth surface of donor material. In embodiments, additional support forthe scraper may be included, for example a pattern of ribs 1510 forminga plurality of recesses may be used, as shown in FIG. 15E. Because theribs are in the middle of the donor material area, they prevent the areaoccupied by the rib and proximate to the rib from being used for LIFT.Therefore, in embodiments using target substrates with ribs, a jobplanning program is made aware of the excluded areas of the ribs andplans the LIFT job so these areas are not used.

FIG. 15D shows an embodiment of a donor substrate including a pluralityof recesses 1504 containing donor material. As noted above the recessesmay form a grid of donor material dots on the donor substrate 1502. Torecoat the dots donor material is spread across the substrate fillingempty recesses and a scraper 1508 is moved along the top surface of thedonor substrate to remove excess donor material only leaving donormaterial within the dots. Using substrates with recesses has theadvantage wherein the unused donor material in dots does not need to beremoved prior to recoating because donor material will only fill emptyrecesses from which donor material was previously ejected.

FIG. 15F shows an embodiment of recoating a target substrate with aprofiled scraper 1512. The profiled scraper has protrusions 1514 thattouch the transparent carrier surface 1516 and maintain the height ofthe edges 1518 of the scraper to create an even, and well controlled,film thickness of donor material 1520. Like in FIG. 15E the areas of thetarget substrate which did not receive donor material 1520 due to theprotrusions 1514 are excluded by the job planning program. Inembodiments with a profiled scraper, the profiled scraper is moved in amechanical precision jig or stage so the locations of the uncoated areasare accurately known by the job planning program.

FIG. 15G shows an example embodiment, similar to FIG. 15A, wherein thetarget substrates are batch processed. As shown, a cassette 1522 holdingup to ten target substrates 1506 collects the used target substratesafter they are used in the exposure station 1502 for writing a patternon a workpiece 1508. When the cassette 1522 is full it is automaticallytransferred to the regeneration station 1504 and the substrates areregenerated as described above. After the substrates are regenerated thecassette is automatically moved back sent to exposure station. Theadvantage of a cassette embodiment is that the regeneration and theoptical stations are less tightly coupled. The cassettes can be handledmanually since they need to be changed less frequently, and they can bein different rooms and may be carried by hand. The disadvantage of usingcassettes is that there needs to be more target substrates incirculation than in the embodiment shown in FIG. 15a . In an example onesubstrate may be used for one minute. After ten minutes the cassette atthe exposure station is full and moves to the regeneration station. Thepreviously regenerated cassette is then full and starts to providesubstrates for writing at the exposure station. A third cassette may bemoves empty to the uptake position. Every ten minutes a cassette needsto be circulated and there are twenty substrates in circulation. Eachtarget substrate is used within ten minutes after it is regenerated. InFIG. 15A the substrates may need to be swapped every minute. FIG. 15A isshown with eight substrates in circulation, but may be used with as fewas two target substrates, and would be reasonably efficient with fourtarget substrates. The time between regeneration and use at the exposuresystem would be three, zero, or one minute respectively. If there is anunbalance between the speed of the writing system and the regenerationsystem, in embodiments, multiple regeneration stations, e.g. two orthree, may be used for each writing system, or vice versa.

In the embodiments shown in FIGS. 15A and 15B, the target substrateplates are smaller than the work piece to be patterned and the donorsubstrate plates are moved relative to the workpiece by a motion controlsystem. For example the workpiece may be on an x-y stage.

FIGS. 16A-B show an example scanning motion of a target substrate plate1602 relative to a workpiece 1604. In the example, the strokes in thedownward direction are writing strokes 1606, wherein the donor substrateis exposed with the laser causing ejection of the donor material withthe LIFT process. The generally upward strokes are return strokes 1608,wherein the donor substrate is not exposed with the laser. However, inembodiments, the donor substrate may be exposed during any point in itsscanning motion. Further, as discussed above, the substrate may beexposed during motion of the target substrate relative to the workpiece.However, in embodiments, the substrate may be stopped during exposure.In embodiments, the target substrate 1602 may overlap a portion of theworkpiece 1604 in two or more passes allowing for multi pass writing ofa portion of the workpiece. This may be beneficial for example wherelayers of donor material are stacked on top of one another on the samelocation of a workpiece, for example the “fill mode” discussed above.

In embodiments, the pattern to be deposited on the workpiece may have alow density and a repeating sweeping writing pattern as shown in FIG.16A may be an inefficient use of time. Therefore, in embodiments, therelative movement of the target substrate 1602 and workpiece 1604 may beirregular, for example as shown in FIG. 16B, in order to pattern theworkpiece in an optimal time.

FIGS. 17A-B show examples of how oblique relative scanning of the targetsubstrate and workpiece can be accomplished. In FIG. 17A, the targetsubstrate 1702 is oriented at an oblique angle relative to the workpiece1704. In FIG. 17B, the target substrate 1702 is oriented parallel to theworkpiece 1704 the target substrate 1702 is oriented at an anglerelative to the workpiece 1704 the target substrate 1702 is oriented atan angle relative to the workpiece 1704 and the relative motion 1706 isoblique to the alignment of the target substrate and workpiece.

FIGS. 18A-C show embodiments of a belt target substrate being scanned atan oblique angle relative to the axes of the workpiece. In FIG. 18A theworkpiece 1802, which may be a PCB or other electronic substrate, isadvancing step by step. The belt target substrate 1804 scanscontinuously at an angle to the axes of workpiece 1802, thereby creatingan oblique relative motion. In FIG. 18B the workpiece 1802 has anoblique angle to the axes of the belt target substrate 1804 movement.The direction of the step by step movement of the workpiece is notimportant.

FIG. 18C shows an oblique relative motion created by simultaneousscanning of both the belt target substrate 1804 and workpiece 1802. Itis shown that a target position on the workpiece will coincide with anumber of dots on the belt target substrate 1804. The target can bejetted with any one of these dots and they are spread across the belt.Selection of one or the other dot for jetting will affect how the dotson the belt are consumed. It is thus possible to predict a selection ofdots to each target position which will consume the dots on the donormost effectively, i.e. leave the fewest dots to waste. In embodiments,the time limitations of the repositioning of the laser beam may be usedto optimize, or make shorter, the time it takes to jet the entireworkpiece.

In addition to reusing target substrate plates by moving the targetsubstrate plates between a recoating station and an exposure station,high donor material utilization can also be accomplished through theuses of a continuous loop belt target substrate.

FIG. 19 shows an embodiment of a LIFT system including a regenerationstation and exposure station, similar to FIG. 15A, and including acontinuously loop belt target substrate 1902. The belt runs around aseries of rollers/bearings 1904 through the exposure station 1906 andthe recoating station 1908. The belt forms a loop and may be composed ofthin glass, PC, polyimide, or silicon rubber. In embodiments, a portionof the belt is exposed in the exposure station where it might bedepleted or partially depleted and then is recoated in the recoatingstation. The system may employ continuous motion during the LIFT processand the belt will be recoated with donor material regardless on theamount transferred to the work piece during the exposure. Unlike thetarget substrate plate embodiment shown in FIG. 15A, there is no timecost for recoating a portion of the belt still usable for LIFT becauseit is in constant motion.

In the recoating station 1908 a similar process as discussed above takesplace. For example the recoating station may include a scraper 1910which removes any unejected donor material from the portion of the beltgoing through the scraper. The removed donor material may be process tobe reapplied to the target substrate belt. Following removal, donormaterial is applied to the belt, the applied donor material may be acombination of one or more of removed/process donor material and newdonor material. After application, the applied donor film may befinished by scraping or drying. As shown due to the nature of acontinuous belt, portion of the belt are simultaneously being scraped,applied with donor material, having the applied donor material finishedand exposed with a laser to cause the LIFT process.

In this example embodiment all remaining donor material is scraped orwashed away to leave the belt clean. Then new material is added and thedonor material is formed into a film. The scraped-off material is sentfor recycling. In embodiments, two or more layers of material, e.g. adonor and a surface-active layer or a dynamic release layer, may becoating onto the belt in the regeneration station. The layers can bedried by heat or hardened by light or heat. The time constant for thesematerials may be about one second which is useful for an endless beltembodiment, wherein the belt is in constant motion. In embodiments, thebelt runs at 4-5 meters per minute and may be 2 meters long. In such afast system each process step may be finished in a couple of seconds.

Further, the embodiment of the system in FIG. 19 may include aregeneration station wherein donor material is scraped up andreplenishment donor material is added. The two types of material aremixed thoroughly and a new uniform film of donor on the target substratemay be created from it. This embodiment has higher utilization ofmaterial, but may not be applicable to all donor materials, such asdonor that has been dried or hardened or is affected by the air.

Furthermore after recoating, the finished layer in FIG. 19 may beinspected for holes and particles after being finished and any errorscan be marked as excluded area in the pre-assignment step.

Because the utilization of donor material of a portion of the beltexposed in a single pass is not critical due to the potential for highreuse of all unused donor material, the belt may run at high speeds, forexample 4-5 meters per minute.

Due to the different level of “cleanliness” the exposure station andrecoating station may be separated by a divider, such as a barrier floor1912 as shown in FIG. 19, to prevent the workpiece from beingcontaminated by the recoating station.

As shown the outside surface of the target belt substrate 1902 is coatedwith donor material. In the embodiment shown, the portion of the beltwhere the outside surface is facing up is received by the regenerationstation 1908 and the portion of the belt with the outside surface facingdown is received through the exposure station 1906. As noted above, thisconfiguration takes advantage of gravity in the coating and transferprocesses. However in embodiments, other belt configuration may beemployed. Further, in the embodiment shown, four rollers are included,however in embodiments other roller numbers and configuration may beused. Further, porous air bearings may be used to avoid actual contactwith either face of the target substrate belt.

In the embodiment shown, the workpiece 1914 is shown as a sheet but inother embodiments may be wafers, panels, glass panes, plastic or metalsheets, roll-fed plastic or metal foil, thin glass, etc.

In embodiments including a continuous loop belt target substrates, thepulsed laser is vector-addressed, i.e. it can reach points in the fieldin an arbitrary order. There may be a combination of a fast small fieldscanner, e.g. a small galvanometer or an acousto-optic deflector, and aslower large-field galvanometer to get fast point to point movement in alarge field. There may also be an SLM, either coherent SLM or a DMDmicromirror chip, for impressing a shape on the beam before it isdeflected. In the example embodiment of FIG. 19 the laser beam isinjected into the endless belt loop via a mirror. As described elsewherein this disclosure the a priori known features on the workpiece to becoated with donor and the relative movement of the belt and theworkpiece allow for pre-assignment of each feature on the workpiece to apoint on the belt where the donor material will be ejected. There laseris able to hit a point on the belt target substrate when the point onthe belt target substrate is closest to the corresponding site on theworkpiece. When assigning points and features, a job planning programtakes into account the relative motions of the donor and the workpiece,as well as complications like the timing limitations of the laser andoptical deflection and excluded areas on the donor, which cannot be usedfor LIFT. By moving the target substrate obliquely relative to theworkpiece the Manhattan character of most patterns on workpieces can beaveraged out and more efficient use of the donor area can be made. Theangle between the workpiece and the donor can be tuned to make the useof the donor area better.

In embodiments, a pre-analysis of the donor efficiency is conducted bythe job planning program before points on the donor are pre-assigned tofeatures on the workpiece. If this analysis shows unsatisfactoryefficiency a different angle may be used. For example, if there is aManhattan geometry an angle such as 5 degrees may be selected. Apre-analysis of the pattern is done based the selected angle. Based onthe selected angle and the assumed movement during writing, the pointson the target substrate to be jetted are pre-determined. In embodiments,to speed up the analysis a sample of only some of the points in apattern may be used, e.g. 1000 shots. If the shots can be predeterminedto reasonably efficiently deplete the donor on the donor sheet theselected angle is used to orient the pattern. If the selected angle ispredetermined not to efficiently deplete donor material then the angleis adjusted by a small amount, for example 1 degree, and the analysis isrun again until a satisfactory angle is found. If all angles aredetermined to be unsatisfactory then the most efficient angle isselected. Further, in embodiments orientation angle may be calculatedfor a Manhattan geometry based at least in part on projection of thedonor material requirements for at least a segment of the pattern on theworkpiece onto a base line.

In regard to the continuous motion embodiments, including regenerationstations, all other elements described in this application, e.g. obliquegrid, rotated scanning directions, pre-assignment of dots to positionson the workpiece multiple passes may be implemented in theseembodiments.

FIG. 20 shows an example embodiment where the target substrate is fed asrolls of tape 2002 with a film of donor material. The used tape moves toa take-up roll and may be sent away for material regeneration ordisposed of. The rolls are shown with machine-readable tags which mayconnect to a database where data about the roll is stored such assupplier, article number, individual ID, material composition,thickness, suitable pulse energy, how much of the tape is used, etc. Theexample system is shown to write on a foil 2004 and it has a fastsmall-field optical scanner 2006, which can be mechanical (piezomirrorswith high bandwidth) or optical (e.g. acoustooptical, electrooptical),and a large-field optical scanner 2008 which has a field large enough toscan across the workpiece or a foil.

The laser 2010 has an illuminator 2012 which spreads the beam over anarea illuminating a beam shaper 2014. The beam is shaped by an apertureby moving rulers or by an SLM, preferably a coherent spatial lightmodulator such as an LCD or coherent micromechanical mirror device, andsent by the large field scanner to an area on the workpiece 2004. Thelarge-field scanner is relatively slow compared to the other componentsand sets the beam to an area on the workpiece, where it is quickly movedfrom point to point by the fast small-field scanner and the shape of thebeam is either stationary or dynamically changed by the rulers or SLM.The tape has handling areas at the sides and the figure shows driverollers using these areas. There can also be alignment information, e.g.mechanical indentations or cinema-style holes for alignment andtraction.

FIG. 21A shows an optical principle of another example embodiment. Ithas a small field piezo scanner 2102 with high bandwidth and alarge-angle scanner 2104 with less bandwidth, sending the beam to awide-field lens 2106. The wide field lens 2106 which may have a diameterof 500 mm or more sets the beam at one place on the workpiece/acceptor2108. The target substrate 2110 with donor material extends across allor a substantial part of the large field. Once the large-field scannerhas set the beam to an area on the workpiece the fast small-fieldscanner can move it quickly in x and y within a field which may be 30×30mm.

FIG. 21B shows how the Gaussian spot can be reshaped by a phase filteras shown in FIG. 21A, so that it has a more flat cross section andsteeper edges. FIG. 21B shows the Gaussian spot (dashed), a spot after aphase filter has been inserted in the beam path (thin solid line) andthe latter spot shrunk back to the size of the Gaussian spot by means ofa higher NA lens (thick solid line). The shrunk beam has the same sizeas the Gaussian beam but has a more flat energy profile and steeperedges, improving the process latitude.

FIG. 22 shows a conceptual 3D printer using the principles laid out inthis application for fast laser jetting. The flexible choices oftransferred materials and the small shots possible makes laser jetting acompelling option for 3D printing of small or delicate parts. Theembodiment includes a target substrate 2202, a stage 2204, and a 3Dprinted model 2206.

FIG. 23 shows an embodiment of a 3D printer applied to patterning orcoating of 3D objects. The embodiment includes a target substrate 2302which is used to transfer donor material onto a 3-dimensional workpiece2304.

FIG. 24B depicts an embodiment of a system architecture similar to FIG.21A with a fast small-field 2402 and a slower large-field scanner 2404.The advantage is that the system is able to quickly hit a large numberof points within the small field, then reposition the small field withina large field to find a new large number of points to work on. The fastscanner can be an acousto-optic scanner which can do random accessaddressing of 100 000 to 200 000 points within a 1000×1000 point field.The large field scanner is preferably a galvanometer scanner which maymove the small field about 1000 times per second. In embodiments,multiple beams may be use and/or multiple lasers for more flashes persecond. FIG. 21B shows that the beam can be tweaked to have a moreuniform disc shape for more uniform dots.

In FIG. 24B an SLM 2406 is included. The SLM can be a coherent MEMS SLM,or an LCD SLM as is manufactured by HoloOr (Berlin, Germany) and othercompanies. In embodiments, the SLM may also be a non-coherentmicromirror device as the DMD chip from Texas Instruments. LIFT withstructured light from a DMD mirror has recently been described byRaymond Auyeung et al. in Optics Express, Vol. 23, Issue 1, pp. 422-430(2015). They describe using the demagnified image from a DMD to transfershapes. Comparing possible SLMs, the DMD has a useful update rate ofabout 30 kHz, higher than both the coherent MEMS SLM developed by theassignee and the LCD SLMs that are commercially available. In theexample embodiment in FIG. 24B the light is stricter near the lasersource 2408 and the shape that is impressed on the light beam follows itthrough the scanning optics. Therefore the SLM can make a shape andchange it 30 000 times per second and the scanning system can make 200000 prints of the shape on the workpiece 2410. FIG. 24A shows inconceptual form a writer with shaped light and fast scanner for LIFT.The writer includes a laser 2412, a beam shaper 2414 (e.g. SLM), asecond beam shaper 2416, a target substrate movement stage 2418, and aworkpiece movement stage 2420, all attaches to a digital controller2422. The Digital controller accepts a pattern to be produced andcontrols the stage with the acceptor and the stage with the donor, theoptical scanner, the beam shaper, and the emission of laser pulses. Notethat the addition of the SLM makes the system much faster sincecomplicated patterns can be built from shapes, not dots.

The systems in FIGS. 24A and 24B can be combined with several otheraspect of the technology disclosed herein. The DMD does not withstandhigh energy pulses, but the pulse energy can be magnified by thechemically amplified explosive layer. The writing can be combined withcontinuously fed donor materials or by non-interrupted circulation ofdonor substrates.

FIGS. 24 C-E show more in detail of how the pre-assignment works in anexample embodiment. In FIG. 24C the workpiece 2450, which can be a PCB,is patterned by LIFT. The dashed features 2452 are the locations wheredonor material is to be printed. The pattern of features 2452 isdescribed in a digital pattern description which is input to the digitalcontroller. Since there are repetitive patterns along the axes of theworkpiece it is beneficial to use an oblique angle. The donor comes froma tape 2454 which comes from a roll of prefabricated donor tape or maybe the endless loop shown and described above. There is a large opticalfield 2466 covering the entire width of the workpiece 2450. This fieldis addressed by a galvanometric x-y scanner which has a time toaccurately settle to a new position of 1 millisecond. There is also afast acousto-optic x-y scanner which can deflect the beam within a smallfield. Six such small fast scanner fields FSF1-6 are shown each with adifferent setting of the galvanometer. Within a fast field the beam canbe repositioned up to 200 000 times per second. In FIG. 24C thegalvanometer is set to the FSF1. Some of the features within FSF1 arealready written, the hatched ones 2460. The fast scanner positions thebeam on the features that have not been written before, the blackfeatures 2462, and write them quickly. It has to position the beam onthe feature 2462, form the shape by the SLM and then wait until there isuseful donor above a feature and pulse the laser. Then the next featurewill be written. FIG. 24C is written with features with a shape which iswritten with an SLM. The principle is the same without the SLM but thepattern is divided into round patches instead of shapes. Since eachfeature needs to be defied by several round patches a system with an SLMis much faster. When writing the field FSF1 the digital controllerleaves some features 2464 which will be written in a later field FSFS.When all planned features of FSF1 are written the galvanometer moves thefield to FSF2.

FIG. 24D shows when the galvanometer has repositioned the beam to FSF2.The workpiece and tape are moving, in this example the workpiece hasmoved from 2450 to 2451 and the tape from 2456 to 2457. The blackfeatures 2480 are written. Some of them have the same shape and can bewritten with the same shape on the SLM, i.e. at the speed determined bythe fast scanner, 200 000 per second, instead of the SLM's 30000 persecond. Other features 2482 are left unexposed because in the planningthey are assigned to a different field written later.

In FIG. 24E the workpiece is wider than the large optical field 2490.Therefore the mechanical stage need to reposition the writing system orthe workpiece so the field falls in a new position 2492 after 2490 hasbeen finished. The writing sequence has to be planned well in advancedfor the system to write at a high average speed without waiting too longfor points to coincide. Likewise the number of fields should be smalland the area utilization of the donor on the tape must be high. Thetiming of the continuous movement and the time constraints on the laserand optical scanners are taken into account. This is an optimizationproblem similar to the Travelling Salesman's Problem, but an optimalsolution need not be found, only one solution which gives good enoughthroughput and reasonable utilization of the donor material. Theparameters of the optimization can be tuned for speed or materialefficiency, depending on the situation and cost of the donor material.

The technology disclosed includes a method of depositing material in apattern on a workpiece by transfer of donor material by laser inducedforward transfer. The method includes providing a first and secondtarget substrate plats including laser transparent supports and initialcoatings including donor material, at an exposure station, pulsing alaser beam through the first target substrate plate causing portions ofdonor material to be transferred from the first target substrate plateto form a portion of the pattern on the workpiece. The method furtherincludes, concurrently with pulsing the laser beam through the firsttarget substrate plate, at a recoating station, recoating with donormaterial the second target substrate plate, wherein, prior to recoating,the second target substrate plate includes portions from which donormaterial was previously transferred, causing the recoated second targetsubstrate plate to be moved from the recoating station to the exposurestation; and at the exposure station, pulsing the laser beam through thesecond target substrate plate causing portions of donor material to betransferred from the second target substrate plate to form a portion ofthe pattern on the workpiece or a second workpiece.

In embodiments, the first and second target substrate plates eachinclude an outer face including the donor material, wherein at therecoating station the outer faces face upwards relative to gravity andare recoated with donor material; and wherein at the exposure stationthe outer faces face downwards relative to gravity. Also in embodiments,the coating includes removing the initial coating of donor material fromthe second target substrate plate, and depositing a layer of donormaterial on the second target substrate plate after removing the initialcoating. Further in embodiments the recoating includes removing theinitial coating of donor material from the second target substrateplate, and depositing a grid pattern of discrete separated dots of donormaterial on the second target substrate plate after removing the initialcoating. Wherein pulsing the laser beam through the second targetsubstrate plate includes causing the discrete separated dots to betransferred from the target substrate to form the corresponding patternon the workpiece. In embodiments, the recoating includes filling intrenches from which donor material was previously transferred, whereinthe trenches form a grid pattern on the second target substrate plate.In embodiments, the recoating includes localized recoating of portionsof the second target substrate plate where donor material has beentransferred from plate by the laser beam pulse. In embodiments, therecoating includes jet printing of donor material onto the second targetsubstrate plate. In embodiments, said first and second target substrateplates are moved back and forth between the recoating station and theexposure station in an iterative closed loop process in order to berepeatedly recoated with donor material and then sequentially exposed tosaid laser beam. Also in embodiments, the method includes the use of atleast three target substrate plates, including the first and secondtarget substrate plates, wherein the at least three target substrateplates are sequentially moved back and forth between the recoatingstation and the exposure station in an iterative closed loop process inorder to be repeatedly recoated and then sequentially exposed to saidlaser beam.

The technology further includes a device for depositing material in apattern on workpieces by transfer of donor material by laser inducedforward transfer, including, target substrate plates including lasertransparent supports and initial coatings including donor material, anexposure station, including a laser, configured to receive the targetsubstrate plates, and pulse a laser beam through each of the targetsubstrate plates to cause portions of the donor material to betransferred from the target substrate plates to the workpieces, arecoating station configured to receive the target substrate plates andrecoat the target substrate plates, and a motion control systemconfigured to move the target substrate plates from the exposure stationto the recoating station. In embodiments, the target substrate platesinclude outer faces including the donor material, and wherein the motioncontrol system positions the outer face oriented upwards relative togravity at the recoating station and positions the outer face orienteddownwards relative to gravity at the exposure system.

In embodiments, the target substrate plates include two target substrateplates configured to be reused in a continuous process wherein each ofthe two target substrate plates are repeatedly recoated and thensequentially exposed to said laser beam by being moved back and forthbetween the recoating station and the exposure station in an iterativeclosed loop process.

In embodiments, the target substrate plates comprises at least threetarget substrate plates configured to be reused in a continuous processwherein each one of the at least three target substrate plates arerepeatedly recoated and then sequentially exposed to said laser beam bybeing moved back and forth between the recoating station and theexposure station in an iterative closed loop process.

The technology further includes a method of efficiently transferringdonor material by laser induced forward transfer from a target substrateto the workpiece, including providing one surface of a target substratewith a pattern of discrete separated dots of donor material, orientingthe surface with the pattern of discrete separated dots of donormaterial to face a workpiece, and pulsing a laser beam through thetarget substrate, causing the discrete separated dots to be transferredfrom the target substrate to form a pattern on the workpiece.

Embodiments include the pattern including a Manhattan geometry, and themethod further including causing the target substrate to move relativeto the workpiece in a relative direction of motion, and orienting thepattern on the workpiece askew to the relative direction of motion,wherein the askew orientation angle more evenly distributes donormaterial requirements, imposed by the Manhattan geometry pattern, acrossthe target substrate in a direction perpendicular to the relativedirection of movement.

Embodiments, include calculating for the Manhattan geometry an askeworientation angle based at least in part on projection of the donormaterial requirements for at least a segment of the pattern on theworkpiece onto a base line.

Embodiments include the pattern of discrete separated dots includingdots of different shapes and sizes. Embodiments include the pattern ofdiscrete separated dots including portions of donor material withthicknesses that vary by at least 20 percent.

Embodiments include pulsing a laser beam through the target substrateincluding focusing the laser beam on an area of the target substratelarger than the discrete separated dot to be ejected.

Embodiments include the pattern of discrete separated dots being formedwithin recesses in the surface of the target substrate.

Embodiments include, the pattern of discrete separated dots including afirst dot having a first thicknesses and a second dot having a secondthickness different than the first thickness.

Embodiments further include the pattern of the discrete separated dotsbeing a hexagonal pattern.

The terms and expressions employed herein are used as terms andexpressions of description and not of limitation, and there is nointention, in the use of such terms and expressions, of excluding anyequivalents of the features shown and described or portions thereof. Inaddition, having described certain implementations of the technologydisclosed, it will be apparent to those of ordinary skill in the artthat other implementations incorporating the concepts disclosed hereincan be used without departing from the spirit and scope of thetechnology disclosed. Accordingly, the described implementations are tobe considered in all respects as only illustrative and not restrictive.

What is claimed is:
 1. A method of transferring donor material by laserinduced forward transfer from a target substrate to a workpiece,including: providing one surface of a target substrate with a pattern ofdiscrete separated dots of donor material; orienting the surface withthe pattern of discrete separated dots of donor material to face aworkpiece; pulsing a laser beam through the target substrate, causingthe discrete separated dots to be transferred from the target substrateto form a pattern on the workpiece in a Manhattan geometry pattern;causing the target substrate to move relative to the workpiece in arelative direction of motion; and orienting the pattern on the workpieceaskew to the relative direction of motion, wherein the askew orientationangle more evenly distributes donor material requirements, imposed bythe Manhattan geometry pattern, across the target substrate in adirection perpendicular to the relative direction of movement.
 2. Themethod of claim 1, further including calculating for the Manhattangeometry the askew orientation angle based at least in part onprojection of the donor material requirements for at least a segment ofthe pattern on the workpiece onto a base line.
 3. The method of claim 1,wherein the pattern of discrete separated dots includes dots ofdifferent sizes.
 4. The method of claim 2, wherein the pattern ofdiscrete separated dots includes dots of different shapes.
 5. The methodof claim 1, wherein the pattern of discrete separated dots includes adot including portions of donor material with thicknesses that vary byat least 20 percent.
 6. The method of claim 1, wherein the pulsing thelaser beam through the target substrate includes focusing the laser beamon an area of the target substrate larger than the discrete separateddot to be ejected.
 7. The method of claim 1, wherein the pattern ofdiscrete separated dots are formed within recesses in the surface of thetarget substrate.
 8. The method of claim 1, wherein the pattern ofdiscrete separated dots includes a first dot having a first thicknessand a second dot having a second thickness different than the firstthickness.
 9. The method of claim 1, wherein the pattern of the discreteseparated dots is a hexagonal pattern.
 10. The method of claim 2,wherein the pattern of discrete separated dots includes a dot includingportions of donor material with thicknesses that vary by at least 20percent.
 11. The method of claim 2, wherein the pulsing the laser beamthrough the target substrate includes focusing the laser beam on an areaof the target substrate larger than the discrete separated dot to beejected.
 12. The method of claim 2, wherein the pattern of discreteseparated dots are formed within recesses in the surface of the targetsubstrate.
 13. The method of claim 2, wherein the pattern of discreteseparated dots includes a first dot having a first thickness and asecond dot having a second thickness different than the first thickness.14. The method of claim 3, wherein the pulsing the laser beam throughthe target substrate includes focusing the laser beam on an area of thetarget substrate larger than the discrete separated dot to be ejected.15. The method of claim 3, wherein the pattern of discrete separateddots are formed within recesses in the surface of the target substrate.16. The method of claim 3, wherein the pattern of discrete separateddots includes a first dot having a first thickness and a second dothaving a second thickness different than the first thickness.
 17. Themethod of claim 4, wherein the pattern of discrete separated dots areformed within recesses in the surface of the target substrate.
 18. Themethod of claim 4, wherein the pattern of discrete separated dotsincludes a first dot having a first thickness and a second dot having asecond thickness different than the first thickness.
 19. The method ofclaim 5, wherein the pattern of discrete separated dots includes a firstdot having a first thickness and a second dot having a second thicknessdifferent than the first thickness.